San Diego, CA – October 10, 2006 – Advanced Applied Adhesives today announced the availability in production quantities of a new and improved family of Self-Filleting™ die attach adhesives. Designated AAA3300, this unique series of materials exhibits capillary flow during a programmed temperature ramp-up, achieving 100% area coverage under the die without producing a bulky fillet that can overflow onto the top of thin die before the cure onset temperature is reached. Compared to die attach film, the AAA3300 series is significantly less expensive with better wetting to BGA substrates and die top. Currently there are three products offered in this series, AAA3300, AAA3310 and AAA3320. AAA3300 and AAA3310 are recommended for BGA and Alloy 42 applications where substrate warpage is a concern. AAA3320 is ideal for same die stacking where low CTE is critical to reducing encapsulated wirebond fatigue and failure. The Self-Filleting™ process extends the service life for existing die bonders and allows users to continue to benefit from the cost and reliability of a die attach paste. Also, die attach adhesive costs are independent of wafer yield and capital investment in tape bonding equipment is not required.

Figure 1 illustrates the Self-Filleting™ feature of AAA3320 after a standard double “Y” pattern is dispensed. The material flows during a standard ramp cure profile covering the entire die area. AAA3320 has the advantage of a film at the cost of a standard die attach material and can be sold with spacers for bondline control.

AAA3300 and AAA3310 also show improved Self-Filleting™ properties over AAA1002A. In addition to their low modulus, AAA3300 and AAA3310 offer exceptionally high adhesion to substrate materials. These unique features make the AAA3300 series ideal for high reliability, low cost packaging.

“As I’ve said before, the Self-Filleting™ die attach adhesive is truly a breakthrough product. It enables thin die assembly at improved yields, reduces costs and utilizes conventional assembly techniques without the need for expensive tape bonding or wafer coating equipment,” stated Frank Husson, Advanced Applied Adhesives President and CEO. “By broadening the applications for Self-FilletingTM, we have taken another big step in reducing cost and improving ease of assembly.”

Advanced Applied Adhesives was founded in 2002 by Mr. Husson to manufacture and market die attach adhesives and specialty materials for the microelectronics industry. The company occupies a world-class 32,000 square foot facility in San Diego that had previously been Honeywell Incorporated’s Advanced Polymer Operation. The building has explosion-proof laboratories, Class 1000-10,000 clean rooms and extensive production and analytical equipment for volume manufacturing of precious metal powders, proprietary polymers and specialty adhesives.

Advanced Applied Adhesives has a strategic alliance with Designer Molecules, Inc. (DMI), a sister company with common ownership. Also founded by Mr. Husson in 2001, DMI’s business model is focused on the design and licensing of unique molecules, including adhesive molecules for specific customer requirements. DMI’s co-founder, Dr. Stephen Dershem, the inventor of the first BMI liquid monomer, is also a principal of the company.