| 
Posters
Corporate Poster Maps
Magazines
Industry News
Industry Showroom
Corporate Who's Who
Trade Directory
Networking
Payment
Posters Price List
Newsletter
Be informed of site updates
Name:

Email:

Receive HTML mailings?
Industry Verticals
INDUSTRIAL
TECHNOLOGY
MATERIALS
MANUFACTURING
CONSUMERS & SERVICES


Submit Industry News (Registered Corporate Users Only. Registration is Free)                       

Submit Jobs Posting (Registered Corporate Users Only. Registration is Free)                   
Home arrow Industry News arrow Semiconductor arrow Creative Selects Ambarella to Power Its Third-Generation Vado HD Pocket Video Cam
Creative Selects Ambarella to Power Its Third-Generation Vado HD Pocket Video Cam | Print |
SANTA CLARA, CA – January 26, 2010 -- Ambarella, Inc., a leader in low-power, high- definition video compression and image processing semiconductors, has announced that its HD hybrid camera SoC solution is featured in the third-generation Creative Vado HD™ pocket video camera. The new Vado HD™ pocket video cam combines a sleek design with stunning HD video quality powered by an Ambarella processor. Ambarella’s superior H.264 video compression and image processing pipeline, low-power design and flexible software architecture make it the natural partner for Creative to enable the new Vado HD™. The third-generation Vado HD video cam is powered by the Ambarella A2S chip, today the industry’s most broadly adopted and mature system platform for hybrid camera systems. The new Vado HD™ exhibits improved video quality and sleeker overall user experience. An Ambarella processor supports manual exposure adjustments to handle low-light or brightly lit conditions, as well as a motion detection mode for recording as soon as motion is sensed. With greatly improved H.264 compression and low-power features, the new Vado HD™ can now hold up to 120 minutes of HD video in 4GB of onboard memory. For more information about the third-generation Vado HD products, please see www.creative.com. “We are pleased to partner with Creative to help deliver a new generation of Vado HD™,” said Fermi Wang, Ambarella CEO. “We share Creative’s vision that superior visual quality and better user experience will further expand the growing market for pocket-size, lifestyle cameras. Ambarella is in a unique position to benefit from this growth with its comprehensive portfolio of advanced silicon technology and best-in-class video and image processing technology.” About Ambarella Ambarella is a technology leader in low-power, high-definition video compression and image processing semiconductors. Ambarella products are helping to define a new class of hybrid digital cameras that bring consumers unmatched high definition video and digital still images together in one device. Many cameras and camcorders from top brands have been shipping worldwide using Ambarella SoC’s. Ambarella‘s technology is also widely used in broadcasting and a large amount of TV programming worldwide is transmitted using Ambarella compression chips. For more information on the Ambarella product line, please visit http://www.ambarella.com.
 
< Prev   Next >
Industry News (Today)
Industry News (Last 7 days)
Industry News (Last 8-30 days)
Industry News (Beyond 30 days)
HDB makes single largest purchase of solar panels
(Semiconductor) Monday, 12 July 2010
Tech sector's early advance paced by chip stocks
(Semiconductor) Monday, 12 July 2010
IPWireless and Altair Semiconductor Unveil first Multi-Band, Multi-Mode LTE Modem
(Semiconductor) Monday, 12 July 2010
Semiconductor sales look to increase
(Semiconductor) Monday, 12 July 2010
Earnings Look Ahead: In 12 days, Cypress Semiconductor Releases Its Quarterly Numbers (CY)
(Semiconductor) Monday, 12 July 2010
Solar Semiconductor and Conex Energy to Develop Over 300 MW of Solar Opportunities in California and
(Semiconductor) Monday, 12 July 2010
Chip giant TSMC breaks quarterly sales record
(Semiconductor) Monday, 12 July 2010
Creative Selects Ambarella to Power Its Third-Generation Vado HD Pocket Video Cam
(Semiconductor) Wednesday, 27 January 2010
Creative Selects Ambarella to Power Its Third-Generation Vado HD Pocket Video Cam
(Semiconductor) Monday, 25 January 2010
JTAG ProVisionT - Now With Added 'Buzz'
(Semiconductor) Monday, 25 January 2010
ZTE Launches the World’s First Commercial EV-DO Rev.B Network in Indonesia
(Semiconductor) Monday, 18 January 2010
Record Demand for Oxford Instruments Ionfab® Ion Beam Tools
(Semiconductor) Friday, 08 January 2010
Oxford Instruments Plasma Technology Launches Flexible Support Agreement Packages
(Semiconductor) Wednesday, 16 December 2009
Veeco’s Introduces the MultiMode 8 High-Performance SPM
(Semiconductor) Wednesday, 16 December 2009
FCI's Web-based Design Tools Simplify Product Selection
(Semiconductor) Wednesday, 16 December 2009
Oxford Instruments receives order from IMB Barcelona for Cluster System
(Semiconductor) Thursday, 10 December 2009
Micromachined piezoelectric harvester with record power output drives fully autonomous wireless sens
(Semiconductor) Wednesday, 09 December 2009
Holst Centre, imec and TNO report world-first plastic transponder circuit at 50 kb/s
(Semiconductor) Wednesday, 09 December 2009
ZTE Becomes China’s First PON Vendor to Obtain MEF Certification
(Semiconductor) Wednesday, 09 December 2009
IMEC, Hasselt University and Artist Screen launch new spin-off Lumoza
(Semiconductor) Wednesday, 09 December 2009
Plasma-Therm Opens New Nextral
(Semiconductor) Wednesday, 09 December 2009
ZTE Partners with SingTel to Run LTE Trials
(Semiconductor) Wednesday, 09 December 2009
PMC-Sierra Awards Scholarships for PTN and OTN Research at the Beijing University of Posts and Telec
(Semiconductor) Wednesday, 09 December 2009
Pickering Interfaces Introduces new LXI High Isolation RF Multiplexer
(Semiconductor) Wednesday, 09 December 2009
Imec presents new GaN-on-Si architecture for enhancement mode power switching devices
(Semiconductor) Wednesday, 09 December 2009
Essensium N.V., an IMEC spin-off, joins the Wavenis Open Standard Alliance and starts volume product
(Semiconductor) Wednesday, 09 December 2009
Nordson ASYMTEK’s Calibrated Process Jetting Reduces Process Variability and Ensures Consistent Disp
(Semiconductor) Wednesday, 11 November 2009
Pickering Interfaces Introduces New PXI Battery Simulator for Automotive
(Semiconductor) Wednesday, 11 November 2009
ZTE Named “World’s Best CDMA Equipment Manufacturer 2009”
(Semiconductor) Wednesday, 11 November 2009
Plasma-Therm Announces Multi-Module
(Semiconductor) Tuesday, 03 November 2009
ZTE Announces 2009 3Q Results
(Infocommunications) Friday, 30 October 2009
Asymtek Features Customer Inspired Conformal Coating Solutions at Productronica Booth A2.339
(Semiconductor) Thursday, 29 October 2009
FDK Introduces 6A High Density Mini POL Converter
(Semiconductor) Thursday, 29 October 2009
FlyScan from Seica SpA, the true integration between ATE Flying Probe and
(Semiconductor) Thursday, 29 October 2009
Indium Corporation’s Director to Present at Sustainability Summit
(Semiconductor) Thursday, 29 October 2009
AdoptSMT Group to unveil the new Digital FeederMaster at Productronica 2009
(Semiconductor) Thursday, 29 October 2009
Diagnosys Systems Limited expands European Sales Team
(Semiconductor) Thursday, 29 October 2009
Purafil Helps Improve Pregnancy Success Rates for Fertility Clinic
(Semiconductor) Thursday, 29 October 2009
PMC-SIERRA REPORTS THIRD QUARTER 2009 RESULTS
(Semiconductor) Thursday, 29 October 2009
Oxford Instruments FlexAL ALD tool strengthens UCSB research projects
(Semiconductor) Thursday, 29 October 2009
EV Group Installs Fusion Wafer Bonding Systems at Two Leading CMOS Image Sensor Manufacturing Facili
(Semiconductor) Saturday, 10 October 2009
TSMC and IMEC join forces to bring novel technology solutions to emerging markets
(Semiconductor) Saturday, 10 October 2009
IMEC’s multi-threaded ADRES processor architecture ready for licensing
(Semiconductor) Saturday, 10 October 2009
ZTE Breaks the Mould on European Smart Phone Market
(Infocommunications) Saturday, 10 October 2009
ZTE and ASTRI to Demonstrate Industry’s First Cross-Vendor LTE TDD IOT at ITU Telecom World
(Infocommunications) Saturday, 10 October 2009
European market leader for pre-owned SMT assembly equipment
(Semiconductor) Saturday, 10 October 2009
New Express Boundary-scan Controller
(Semiconductor) Thursday, 01 October 2009
EV Group's GEMINI Wafer Bonder Selected by Leading Korean Research Center and Foundry Service Provid
(Semiconductor) Thursday, 01 October 2009
Frost & Sullivan: ZTE Leads Global UDC/NGHLR Market
(Semiconductor) Wednesday, 30 September 2009
Next Generation Technologies to Boost Efficiency and Safety
(Semiconductor) Wednesday, 30 September 2009
Indium Corporation Acquires Assets of Reactive NanoTechnologies
(Semiconductor) Wednesday, 23 September 2009
IMEC presents large area solar cells with 18.4% conversion efficiency, featuring Cu-plated contacts
(Semiconductor) Wednesday, 23 September 2009
IMEC unveils promising mechanically-stacked GaAs/Ge multi-junction solar cell
(Semiconductor) Wednesday, 23 September 2009
Total, GDF SUEZ, and Photovoltech join IMEC’s silicon solar cell research program
(Semiconductor) Wednesday, 23 September 2009
ZTE Chosen to Provide Full Scale, Future-Proof Network for Promonte
(Infocommunications) Wednesday, 23 September 2009
Oxford Instruments wins 3 system order from Melbourne Centre for Nanofabrication
(Semiconductor) Wednesday, 23 September 2009
IMEC TO HOUSE KANEKA JAPAN EUROPEAN PHOTOVOLTAICS LAB - ADVANCING JOINT RESEARCH
(Semiconductor) Tuesday, 15 September 2009
Pickering Interfaces Brings Relay Self Test to PXI Switching
(Semiconductor) Tuesday, 15 September 2009
ZTE Inks Contract with Vinaphone to Build UMTS Networks
(Infocommunications) Tuesday, 15 September 2009
IDATE: ZTE Ranks No. 1 in Global FTTx Equipment Market
(Semiconductor) Thursday, 10 September 2009
PMC-Sierra Extends SAS-2 Market Leadership with 6Gb/s SAS Chipset for Enterprise Storage Systems
(Semiconductor) Thursday, 10 September 2009
Indium Corporation Introduces a Thermal Interface Material for IGBT Modules
(Semiconductor) Thursday, 10 September 2009
Veeco Introduces Optium ADS-800 Series Advanced Dicing System
(Semiconductor) Thursday, 03 September 2009
Necklace for long-term and robust cardiac monitoring in daily life
(Semiconductor) Thursday, 03 September 2009
Pickering Interfaces launches new 60-511 Low Thermal EMF 56x33 EMR
(Semiconductor) Thursday, 03 September 2009
IMEC wireless sensor systems enable a better sleep
(Semiconductor) Thursday, 03 September 2009
Fusion perfect: ALLTEC, Expert in Laser Marking, acquires FOBA, Specialist in Laser Marking and Engr
(Semiconductor) Thursday, 03 September 2009
Oxford Instruments launches Nanofab™800 Agile System
(Semiconductor) Thursday, 03 September 2009
Top Stories
IMEC's Technology reports
(Semiconductor) Tuesday, 05 February 2008
“Pierre Vareille is appointed Chief Operating Officer in FCI”
(Semiconductor) Wednesday, 28 November 2007
FCI's Slimline Connector Fully Compliant with SATA-I/O 2.6 Spec
(Semiconductor) Wednesday, 02 July 2008
IMEC INCREASES PERFORMANCE OF HIGH-K METAL-GATE PLANAR CMOS AND FinFETs
(Semiconductor) Wednesday, 12 December 2007
NEW POLYSWITCH™ PICOSMD035F DEVICE OFFERS SMALLEST FORM FACTOR FOR
(Semiconductor) Saturday, 03 November 2007
IMEC's Europractice provides TSMC technologies to European companies and academia
(Semiconductor) Thursday, 12 October 2006
NEC Selects PMC-Sierra’s Metro Transport Semiconductor Solutions for SpectralWave Series
(Semiconductor) Tuesday, 03 October 2006
Oxford Instruments Plasma Technology appoints new Sales Director
(Semiconductor) Tuesday, 26 September 2006
ZTE ACHIEVES XOHM CERTIFICATION FOR WIMAX MODEM
(Semiconductor) Thursday, 09 October 2008
Functional Test Technology Partners
(Semiconductor) Wednesday, 24 June 2009
ADE NanoXam Inline CMP Metrology Tool Monitors
(Semiconductor) Wednesday, 16 August 2006
Asymtek’s PreciseCoat Jet Delivers Conformal Coating into Tight Spaces
(Semiconductor) Sunday, 08 October 2006
Mobius Photonics, Inc. Appoints Distributor Nexlase GmbH
(Semiconductor) Tuesday, 04 March 2008
Datacon to deliver Laurier M9 ultra high accuracy Flip Chip Die Bonder to VTT Technical Research Cen
(Semiconductor) Friday, 10 November 2006
Mattson Technology Extends RTP Product Line Into Thermal Oxidation Growth Segment with Introduction
(Semiconductor) Wednesday, 04 October 2006
Soitec Breaks Ground on New Fab in Singapore
(Semiconductor) Monday, 28 August 2006
Indium Corporation Hosts Global Technical Summit 2006
(Semiconductor) Thursday, 05 October 2006
Fab Owners Association Attracts International Rectifier and Silicon Saxony as New Members
(Semiconductor) Tuesday, 14 November 2006
Pickering Interfaces Introduces New PXI Digital I/O Module
(Semiconductor) Saturday, 27 June 2009
Power Integrations To Receive National Energy-Efficiency Award
(Semiconductor) Thursday, 14 September 2006
Owned&Operated by:
Paddlestone
Events Calendar
M T W T F S S
30311 2 3 4 5
6 7 8 9 10 11 12
13 14 15 16 17 18 19
20 21 22 23 24 25 26
27 28 29 30 1 2 3
Partner Solutions