Techposter - ZTE Launches the World’s First Commercial EV-DO Rev.B Network in Indonesia

Home

ZTE Launches the World’s First Commercial EV-DO Rev.B Network in Indonesia

January 18, 2010, Jakarta – ZTE Corporation (“ZTE”), a leading global provider of telecommunications equipment and network solutions, today announced that it has successfully constructed and launched the world’s first commercial EV-DO (Evolution Data Optimized) Rev.B network. Together with Smart Telecom, one of Indonesia’s CDMA telecommunication service providers, and Qualcomm, the leading developer and innovator of advanced wireless technologies and data solutions, the network has been launched in Bali, Indonesia recently. In this first phase, 48 CDMA base stations have been upgraded to EV-DO Rev.B commercial systems to provide an average download speed of 8.6Mbps to a peak download speed of 9.3Mbps. The commercial network will provide Smart Telecom customers high-quality voice and mobile data services. Through its highly innovative solutions, ZTE has provided Smart Telecom a leading edge in the telecommunication industry in Indonesia, especially among the CDMA operators. ZTE has also this month launched its EV-DO Rev.B data card AC2790 in Indonesia market. ZTE will continue to support Smart Telecom with technology innovations as well as sustainable development to reduce network construction, operation and maintenance costs and to provide local users with the highest quality, high speed communications services. ZTE’s SDR (Software Defined Radio) platform-based EV-DO Rev.B System can smoothly evolve to LTE by simply adding LTE baseband board and upgrading software. Through software advancement, ZTE’s EV-DO Rev.A can evolve easily to an EV-DO Rev.B network. In July 2009, ZTE demonstrated an EV-DO Rev.B Dual-Mode System at EXPO COMM Wireless Japan 2009. Smart Telecom, part of the Indonesia’s renowned consortium Sinar Mas, is one of the leading telecom operators in Indonesia market. Smart Telecom had previously utilized 3.1 Mbps EV-DO Rev.A technology. The 9.3 Mbps download rate of its new EV-DO Rev. B commercial network makes Smart Telecom the fastest 3G network in Indonesia. “EV-DO Rev.B network is now commercially available, and only in the Bali Denpasar area,” said Mr. Sutikno Widjaja, President Director of Smart Telecom. “Within Q1 2010, all existing base stations in Bali will be upgraded to EV-DO Rev.B and by the end of 2010, Rev.B is expected to be available throughout all major cities in Indonesia. To date, Smart has 32 cities covered with its previous evolution, EV-DO Rev.A which provides the most reliable wireless broadband services at download speed of up to 3.1 Mbps.” “It’s an honour for ZTE to cooperate with Smart Telecom to deploy the first EV-DO Rev.B technology in Indonesia, and the world,” said Mr. Cuiyi, President, Asia Pacific Region, ZTE Corporation. “I would like to extend my warmest congratulations to Smart Telecom on becoming the world’s first operator providing commercial EV-DO Rev.B services to its customers. Largely attributable to Smart Telecom’s strong track record for technology development and deployment and its reputation for high levels of service, Indonesian people are now benefiting from experience the most advanced EV-DO data services in the world.” “Together with Smart Telecom, we're glad to launch the world’s first commercial EV-DO Rev.B network in Indonesia. The network will offer unparalleled high-speed broadband data access services to Smart Telecom’s subscribers,” said Mr. Hou Zhengzhi, Managing Director, President of ZTE Mobile Telecom, when receiving the plaque of appreciation, under witness of officials from Economy Division of Communications and Information Department of Indonesia and Local Book of Record (MURI) of Indonesia. ZTE has been leading the EV-DO Rev.B technology development. In February 2009, ZTE placed the world’s first EV-DO Rev.B VoIP call on its CDMA2000 system -- the first of its kind in the industry. In June 2009, ZTE joined with Morocco CDMA operator WANA and Qualcomm to launch the world’s first EV-DO Rev.B commercial trial. ZTE continues to be a leader in CDMA technology innovation. It has ranked first in global CDMA equipment volume shipments for four consecutive years (2006 – 2009), with an accumulated 215,000 CDMA base stations shipped worldwide.

< Prev		Next >

Industry News (Today)

Industry News (Last 7 days)

Industry News (Last 8-30 days)

Industry News (Beyond 30 days)

Creative Selects Ambarella to Power Its Third-Generation Vado HD Pocket Video Cam
(Semiconductor) Wednesday, 27 January 2010

Creative Selects Ambarella to Power Its Third-Generation Vado HD Pocket Video Cam
(Semiconductor) Monday, 25 January 2010

JTAG ProVisionT - Now With Added 'Buzz'
(Semiconductor) Monday, 25 January 2010

ZTE Launches the World’s First Commercial EV-DO Rev.B Network in Indonesia
(Semiconductor) Monday, 18 January 2010

Record Demand for Oxford Instruments Ionfab® Ion Beam Tools
(Semiconductor) Friday, 08 January 2010

Oxford Instruments Plasma Technology Launches Flexible Support Agreement Packages
(Semiconductor) Wednesday, 16 December 2009

Veeco’s Introduces the MultiMode 8 High-Performance SPM
(Semiconductor) Wednesday, 16 December 2009

FCI's Web-based Design Tools Simplify Product Selection
(Semiconductor) Wednesday, 16 December 2009

Oxford Instruments receives order from IMB Barcelona for Cluster System
(Semiconductor) Thursday, 10 December 2009

Micromachined piezoelectric harvester with record power output drives fully autonomous wireless sens
(Semiconductor) Wednesday, 09 December 2009

Holst Centre, imec and TNO report world-first plastic transponder circuit at 50 kb/s
(Semiconductor) Wednesday, 09 December 2009

ZTE Becomes China’s First PON Vendor to Obtain MEF Certification
(Semiconductor) Wednesday, 09 December 2009

IMEC, Hasselt University and Artist Screen launch new spin-off Lumoza
(Semiconductor) Wednesday, 09 December 2009

Plasma-Therm Opens New Nextral
(Semiconductor) Wednesday, 09 December 2009

ZTE Partners with SingTel to Run LTE Trials
(Semiconductor) Wednesday, 09 December 2009

PMC-Sierra Awards Scholarships for PTN and OTN Research at the Beijing University of Posts and Telec
(Semiconductor) Wednesday, 09 December 2009

Pickering Interfaces Introduces new LXI High Isolation RF Multiplexer
(Semiconductor) Wednesday, 09 December 2009

Imec presents new GaN-on-Si architecture for enhancement mode power switching devices
(Semiconductor) Wednesday, 09 December 2009

Essensium N.V., an IMEC spin-off, joins the Wavenis Open Standard Alliance and starts volume product
(Semiconductor) Wednesday, 09 December 2009

Nordson ASYMTEK’s Calibrated Process Jetting Reduces Process Variability and Ensures Consistent Disp
(Semiconductor) Wednesday, 11 November 2009

Pickering Interfaces Introduces New PXI Battery Simulator for Automotive
(Semiconductor) Wednesday, 11 November 2009

ZTE Named “World’s Best CDMA Equipment Manufacturer 2009”
(Semiconductor) Wednesday, 11 November 2009

Plasma-Therm Announces Multi-Module
(Semiconductor) Tuesday, 03 November 2009

ZTE Announces 2009 3Q Results
(Infocommunications) Friday, 30 October 2009

Asymtek Features Customer Inspired Conformal Coating Solutions at Productronica Booth A2.339
(Semiconductor) Thursday, 29 October 2009

FDK Introduces 6A High Density Mini POL Converter
(Semiconductor) Thursday, 29 October 2009

FlyScan from Seica SpA, the true integration between ATE Flying Probe and
(Semiconductor) Thursday, 29 October 2009

Indium Corporation’s Director to Present at Sustainability Summit
(Semiconductor) Thursday, 29 October 2009

AdoptSMT Group to unveil the new Digital FeederMaster at Productronica 2009
(Semiconductor) Thursday, 29 October 2009

Diagnosys Systems Limited expands European Sales Team
(Semiconductor) Thursday, 29 October 2009

Purafil Helps Improve Pregnancy Success Rates for Fertility Clinic
(Semiconductor) Thursday, 29 October 2009

PMC-SIERRA REPORTS THIRD QUARTER 2009 RESULTS
(Semiconductor) Thursday, 29 October 2009

Oxford Instruments FlexAL ALD tool strengthens UCSB research projects
(Semiconductor) Thursday, 29 October 2009

EV Group Installs Fusion Wafer Bonding Systems at Two Leading CMOS Image Sensor Manufacturing Facili
(Semiconductor) Saturday, 10 October 2009

TSMC and IMEC join forces to bring novel technology solutions to emerging markets
(Semiconductor) Saturday, 10 October 2009

IMEC’s multi-threaded ADRES processor architecture ready for licensing
(Semiconductor) Saturday, 10 October 2009

ZTE Breaks the Mould on European Smart Phone Market
(Infocommunications) Saturday, 10 October 2009

ZTE and ASTRI to Demonstrate Industry’s First Cross-Vendor LTE TDD IOT at ITU Telecom World
(Infocommunications) Saturday, 10 October 2009

European market leader for pre-owned SMT assembly equipment
(Semiconductor) Saturday, 10 October 2009

New Express Boundary-scan Controller
(Semiconductor) Thursday, 01 October 2009

EV Group's GEMINI Wafer Bonder Selected by Leading Korean Research Center and Foundry Service Provid
(Semiconductor) Thursday, 01 October 2009

Frost & Sullivan: ZTE Leads Global UDC/NGHLR Market
(Semiconductor) Wednesday, 30 September 2009

Next Generation Technologies to Boost Efficiency and Safety
(Semiconductor) Wednesday, 30 September 2009

Indium Corporation Acquires Assets of Reactive NanoTechnologies
(Semiconductor) Wednesday, 23 September 2009

IMEC presents large area solar cells with 18.4% conversion efficiency, featuring Cu-plated contacts
(Semiconductor) Wednesday, 23 September 2009

IMEC unveils promising mechanically-stacked GaAs/Ge multi-junction solar cell
(Semiconductor) Wednesday, 23 September 2009

Total, GDF SUEZ, and Photovoltech join IMEC’s silicon solar cell research program
(Semiconductor) Wednesday, 23 September 2009

ZTE Chosen to Provide Full Scale, Future-Proof Network for Promonte
(Infocommunications) Wednesday, 23 September 2009

Oxford Instruments wins 3 system order from Melbourne Centre for Nanofabrication
(Semiconductor) Wednesday, 23 September 2009

IMEC TO HOUSE KANEKA JAPAN EUROPEAN PHOTOVOLTAICS LAB - ADVANCING JOINT RESEARCH
(Semiconductor) Tuesday, 15 September 2009

Pickering Interfaces Brings Relay Self Test to PXI Switching
(Semiconductor) Tuesday, 15 September 2009

ZTE Inks Contract with Vinaphone to Build UMTS Networks
(Infocommunications) Tuesday, 15 September 2009

IDATE: ZTE Ranks No. 1 in Global FTTx Equipment Market
(Semiconductor) Thursday, 10 September 2009

PMC-Sierra Extends SAS-2 Market Leadership with 6Gb/s SAS Chipset for Enterprise Storage Systems
(Semiconductor) Thursday, 10 September 2009

Indium Corporation Introduces a Thermal Interface Material for IGBT Modules
(Semiconductor) Thursday, 10 September 2009

Veeco Introduces Optium ADS-800 Series Advanced Dicing System
(Semiconductor) Thursday, 03 September 2009

Necklace for long-term and robust cardiac monitoring in daily life
(Semiconductor) Thursday, 03 September 2009

Pickering Interfaces launches new 60-511 Low Thermal EMF 56x33 EMR
(Semiconductor) Thursday, 03 September 2009

IMEC wireless sensor systems enable a better sleep
(Semiconductor) Thursday, 03 September 2009

Fusion perfect: ALLTEC, Expert in Laser Marking, acquires FOBA, Specialist in Laser Marking and Engr
(Semiconductor) Thursday, 03 September 2009

Oxford Instruments launches Nanofab™800 Agile System
(Semiconductor) Thursday, 03 September 2009

FCI Expands FCC Family with Low Profile
(Semiconductor) Tuesday, 01 September 2009

ZTE Leads Data Card Industry with Impressive 366% Growth
(Semiconductor) Wednesday, 26 August 2009

EV Group Unveils Next-Generation UV-Nanoimprint Lithography (UV-NIL) Step and Repeat System-the EVG7
(Semiconductor) Monday, 24 August 2009

IMEC takes 22nm interconnect technology a significant step forward
(Semiconductor) Monday, 24 August 2009

Pickering Interfaces Introduces new High Density LXI 2 Pole Matrices
(Semiconductor) Monday, 24 August 2009

IMEC shows optimizations for next-generation transistors
(Semiconductor) Monday, 24 August 2009

Oxford Instruments wins order from Bridgelux
(Semiconductor) Wednesday, 05 August 2009

ZTE Participates in OIF’s Automatically Switched Optical Network (ASON) Interoperability Test
(Infocommunications) Thursday, 30 July 2009

Oxford Instruments wins order from Bridgelux
(Semiconductor) Thursday, 30 July 2009

ZTE Wins Contract to Build Commercial UMTS Network in Belarus
(Infocommunications) Monday, 27 July 2009

Second Annual Green Manufacturing Conference in Chicago to be Chaired by Technology Forecasters Inc.
(Semiconductor) Monday, 27 July 2009

ZTE Signs Cooperation Agreement with WILLCOM to Provide 3G Data Cards to Japan Market
(Semiconductor) Wednesday, 22 July 2009

ZTE Launches Its First HSPA+ 21.6M Data Card in Greece
(Semiconductor) Tuesday, 21 July 2009

PMC-Sierra's Breakthrough Multi-Service Convergence Platform Enables End-to-End OTN Deployment in Ca
(Semiconductor) Tuesday, 21 July 2009

BASF increases its prices for butanediol and its
(Semiconductor) Friday, 10 July 2009

ZTE and Qualcomm Collaborate to Boost UMTS
(Semiconductor) Friday, 10 July 2009

Oxford Instruments named in FTSE Green Index
(Semiconductor) Friday, 10 July 2009

ZTE Helps CSL with Cutover to HSPA+ Network
(Semiconductor) Tuesday, 30 June 2009

Pickering Interfaces Introduces New PXI Digital I/O Module
(Semiconductor) Saturday, 27 June 2009

Functional Test Technology Partners
(Semiconductor) Wednesday, 24 June 2009

Liam Butterworth is appointed Corporate VP and
(Semiconductor) Tuesday, 23 June 2009

FDK Introduces 3A, 4A, and 6A High Density, Low Profile POL Converters with Output Voltage Tracking
(Semiconductor) Thursday, 18 June 2009

ZTE Helps Etihad Atheeb Telecom Build a Nationwide
(Semiconductor) Wednesday, 17 June 2009

Asymtek Promotes Paul Gallo to Sales Manager, USA & Americas and Tom Schafer to General Manager, Asi
(Semiconductor) Wednesday, 17 June 2009

IMEC reports the fabrication of high-quality ultra-shallow junctions for sub-32nm CMOS devices
(Semiconductor) Wednesday, 17 June 2009

ZTE Launches First-Generation Reconfigurable Multi-Service Router ZXR10 M6000 at CommunicAsia 2009
(Semiconductor) Tuesday, 16 June 2009

ZTE Seals Two Key UMTS Contracts in Asia
(Semiconductor) Tuesday, 16 June 2009

FCI & Tyco Electronics Announce HCI® Power Connector Product License Agreement
(Semiconductor) Friday, 05 June 2009

FCI & Tyco Electronics Announce Pwr TwinBlade™ I/O Connector Product License Agreement
(Semiconductor) Friday, 05 June 2009

EV Group Secures Order Win From Leading RF Components Manufacturer EPCOS
(Semiconductor) Friday, 05 June 2009

Indium Corporation Announces Silver Quill Award Winners
(Semiconductor) Wednesday, 27 May 2009

ZTE SDR Base Station Records over 100,000 Volume Shipment
(Semiconductor) Tuesday, 26 May 2009

FCI Expands Minitek™ Series with
(Semiconductor) Thursday, 30 April 2009

IMEC Board reports solid 2008 and confidence in future
(Semiconductor) Saturday, 25 April 2009

ZTE Corporation today announced its first quarterly results ended 31 March 2009.
(Semiconductor) Friday, 24 April 2009

PMC-SIERRA REPORTS FIRST QUARTER 2009 RESULTS
(Semiconductor) Friday, 24 April 2009

ZTE Solidifies 3G Strategy with the Launch of a
(Semiconductor) Tuesday, 21 April 2009

AMBARELLA AMBACAST6000 PLATFORM USHERS IN A NEW ERA OF BROADCAST VIDEO PROCESSING High Quality, Low
(Semiconductor) Tuesday, 21 April 2009

Nepcon Shanghai Show, Everbright Convention Center, Shanghai for Seica Electronics China - 21-24 Apr
(Semiconductor) Tuesday, 21 April 2009

“FCI Expands D-Sub Series with Economy Range for PCB Applications”
(Semiconductor) Tuesday, 21 April 2009

IMEC Announces Breakthrough in Silicon-Based All-Optical Integrated Circuits
(Semiconductor) Tuesday, 21 April 2009

IMEC and CYTEC collaborate to increase the lifetime of organic photovoltaics
(Semiconductor) Tuesday, 21 April 2009

FDK Introduces 3A, 4A, and 6A High Density Mini POL Converters
(Semiconductor) Tuesday, 21 April 2009

ZTE Helps China Telecom Achieve the Recognition as First in the
(Semiconductor) Tuesday, 07 April 2009

Summit Introduces Industry's Smallest Programmable 500mA Battery Charger
(Semiconductor) Tuesday, 07 April 2009

PMC-Sierra’s End-to-End 6Gb/s SAS Chipset Enables New Levels of RAID Performance Across HP ProLiant
(Semiconductor) Monday, 06 April 2009

IMEC LAUNCHES NEW START-UP PEPRIC
(Semiconductor) Monday, 06 April 2009

Asymtek Features Customer-Inspired Dispensing Solutions at APEX 2009 in Booth 2024
(Semiconductor) Friday, 03 April 2009

IMEC lights 25 birthday candles
(Semiconductor) Friday, 03 April 2009

Digitaltest Establishes New Department for Contract Testing Services
(Semiconductor) Thursday, 26 March 2009

Test Drive the Aegis Verification and Traceability System at APEX Booth 1235
(Semiconductor) Thursday, 26 March 2009

JTAG Production Programming for Texas Instruments' Digital Signal Controllers
(Semiconductor) Thursday, 26 March 2009

Lake Shore Far IR Band Pass Filters Specified for NASA’s FORCAST Instrument on the SOFIA Airborne Te
(Semiconductor) Wednesday, 25 March 2009

iSuppli Research Report: ZTE Gains Largest Share of China’s 3G Market
(Semiconductor) Wednesday, 25 March 2009

Pickering Interfaces Introduces Two New PXI Chassis
(Semiconductor) Wednesday, 25 March 2009

China Development Bank Provides ZTE US$15 Billion Credit Line
(Semiconductor) Friday, 20 March 2009

Test and Measurement Specialist Seica Inc. will exhibit latest updates on systems and solutions - Bo
(Semiconductor) Friday, 20 March 2009

Indium Corporation Technical Papers Accepted for APEX Technical Conference
(Semiconductor) Friday, 20 March 2009

ZTE Tallies 27.37% Revenue Growth Despite of the Bad Global Economic Crunch Company the Clear Leader
(Semiconductor) Friday, 20 March 2009

PMC-Sierra Announces Availability of Industry’s First Symmetric 10G EPON Platforms
(Semiconductor) Friday, 20 March 2009

Agilent Technologies to Collaborate with ASTER for Seamless Test Coverage Analysis across Test Platf
(Semiconductor) Thursday, 19 March 2009

Oxford Instruments wins Best Technology Award
(Semiconductor) Thursday, 19 March 2009

VEECO ENTERS INTO STRATEGIC PARTNERSHIP WITH DAIYANG METAL CO. OF KOREA TO PROVIDE CIGS SOLAR CELL
(Semiconductor) Thursday, 19 March 2009

W. C. Heraeus Launches Rel-k Gold Bonding Wire
(Semiconductor) Friday, 13 March 2009

Innovative New Hardware Modules for Combi-Test Applications -
(Semiconductor) Thursday, 12 March 2009

CCID Industry Report: ZTE, Other 3G Device Providers Play Active Role in Deploying 3G Networks in Ch
(Infocommunications) Tuesday, 10 March 2009

HDMI Licensing Organization Adds FCI Vertical HDMI Connectors to Approved Connector List
(Semiconductor) Tuesday, 10 March 2009

Semi-Polar (11.2) GaN on m-Plane Sapphire by HVPE increases Optoelectronic Device Performance
(Semiconductor) Tuesday, 10 March 2009

ZTE Becomes a Member of UN Global Compact
(Semiconductor) Tuesday, 10 March 2009